About This Role

Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to

next-generation data center SoCs, unlocking the bandwidth, energy efficiency,

and reach that electrical interconnects can no longer sustain. This is a

pioneering opportunity to help shape how Apple's silicon connects at the speed

of light. Are you a hard-working and proactive engineering leader with a

curiosity about optics, photonics, and the future of high-bandwidth silicon

interconnects? We are absolutely seeking you out!

DESCRIPTION

Apple is seeking an experienced Engineering Program Manager to lead Analog,

Mixed-Signal, and Silicon Photonics IP programs within our silicon organization,

with a focus on data center SoCs. In this role, you will drive the end-to-end

development of high-speed AMS and optical IPs, including SerDes, PLLs, Data

Converters, TIAs, drivers, and Silicon Photonics engines / optical I/O

subsystems, from early concept through mass production, ensuring quality,

schedule, and successful delivery across our SoC portfolio. You will bring deep

familiarity with advanced packaging technologies (including 2.5D/3D near and

co-packaged optics), cutting-edge silicon nodes, SiPh process platforms, and AMS

IP development flows and methodologies in an SoC environment. You will serve as

the connective tissue across SoC Integration, IC Design, SoC PD, SoC DV,

Photonics Design, Optical Packaging, CAD, Software, Hardware, Reliability, and

Legal — defining test structure requirements, establishing robust electrical and

optical testing methodologies, and ensuring all technical and compliance gates

are met on schedule. Your ability to distill complex electro-optical technical

information into clear communication, identify risks across a multi-disciplinary

supply chain (foundries, OSATs, laser and optical component vendors), develop

mitigation strategies, and align diverse cross-functional stakeholders will be

critical to delivering on aggressive hardware milestones for data center

silicon.

MINIMUM QUALIFICATIONS

BS in Electrical Engineering, Electrical and Computer Engineering, Applied

Physics, Optics, or a related field, and 10+ years of relevant experience.

Proven track record in AMS IP, Silicon Photonics, or optical interconnect design

or design engineering management.

PREFERRED QUALIFICATIONS

MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials

Science, or an equivalent field. Hands-on program leadership experience with

Silicon Photonics devices and subsystems (lasers, modulators, photodetectors,

waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged

optics (CPO) for data center applications. Extensive experience with AMS IPs

supporting optical interconnects, including high-speed SerDes, TIAs,

laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.

Familiarity with optical packaging concepts: fiber-array attach, active/passive

alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability

considerations for photonic packages. Proven leadership in delivering

high-reliability AMS and/or photonic IPs for data center infrastructure at

scale. Demonstrated ability to define and drive multi-generational IP and

optical interconnect roadmaps in alignment with product strategy and business

objectives. Established track record of executive-level influence and

stakeholder management across large, matrixed organizations spanning silicon,

photonics, packaging, and supply chain. Deep expertise in advanced EDA tools, IP

development methodologies, and SoC integration across cutting-edge technology

nodes for data center platforms. History of proactive risk management and

real-time crisis leadership in high-complexity, high-visibility programs with

direct executive accountability. Experience with adjacent optical technologies

(uLED, uVCSEL) and their applications to SoCs is a plus.

About This Role