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Silicon Photonics (SiPh) and optical I/O are rapidly becoming foundational to
next-generation data center SoCs, unlocking the bandwidth, energy efficiency,
and reach that electrical interconnects can no longer sustain. This is a
pioneering opportunity to help shape how Apple's silicon connects at the speed
of light. Are you a hard-working and proactive engineering leader with a
curiosity about optics, photonics, and the future of high-bandwidth silicon
interconnects? We are absolutely seeking you out!
DESCRIPTION
Apple is seeking an experienced Engineering Program Manager to lead Analog,
Mixed-Signal, and Silicon Photonics IP programs within our silicon organization,
with a focus on data center SoCs. In this role, you will drive the end-to-end
development of high-speed AMS and optical IPs, including SerDes, PLLs, Data
Converters, TIAs, drivers, and Silicon Photonics engines / optical I/O
subsystems, from early concept through mass production, ensuring quality,
schedule, and successful delivery across our SoC portfolio. You will bring deep
familiarity with advanced packaging technologies (including 2.5D/3D near and
co-packaged optics), cutting-edge silicon nodes, SiPh process platforms, and AMS
IP development flows and methodologies in an SoC environment. You will serve as
the connective tissue across SoC Integration, IC Design, SoC PD, SoC DV,
Photonics Design, Optical Packaging, CAD, Software, Hardware, Reliability, and
Legal — defining test structure requirements, establishing robust electrical and
optical testing methodologies, and ensuring all technical and compliance gates
are met on schedule. Your ability to distill complex electro-optical technical
information into clear communication, identify risks across a multi-disciplinary
supply chain (foundries, OSATs, laser and optical component vendors), develop
mitigation strategies, and align diverse cross-functional stakeholders will be
critical to delivering on aggressive hardware milestones for data center
silicon.
MINIMUM QUALIFICATIONS
BS in Electrical Engineering, Electrical and Computer Engineering, Applied
Physics, Optics, or a related field, and 10+ years of relevant experience.
Proven track record in AMS IP, Silicon Photonics, or optical interconnect design
or design engineering management.
PREFERRED QUALIFICATIONS
MS or PhD in Electrical Engineering, Physics (Optics), Photonics, Materials
Science, or an equivalent field. Hands-on program leadership experience with
Silicon Photonics devices and subsystems (lasers, modulators, photodetectors,
waveguides, MUX/DeMUX, grating/edge couplers) and/or optical I/O and co-packaged
optics (CPO) for data center applications. Extensive experience with AMS IPs
supporting optical interconnects, including high-speed SerDes, TIAs,
laser/modulator drivers, CDRs, and PLLs across advanced technology nodes.
Familiarity with optical packaging concepts: fiber-array attach, active/passive
alignment, flip-chip and CoC/CoW/WLP assembly, and thermal / reliability
considerations for photonic packages. Proven leadership in delivering
high-reliability AMS and/or photonic IPs for data center infrastructure at
scale. Demonstrated ability to define and drive multi-generational IP and
optical interconnect roadmaps in alignment with product strategy and business
objectives. Established track record of executive-level influence and
stakeholder management across large, matrixed organizations spanning silicon,
photonics, packaging, and supply chain. Deep expertise in advanced EDA tools, IP
development methodologies, and SoC integration across cutting-edge technology
nodes for data center platforms. History of proactive risk management and
real-time crisis leadership in high-complexity, high-visibility programs with
direct executive accountability. Experience with adjacent optical technologies
(uLED, uVCSEL) and their applications to SoCs is a plus.
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